English translation for "die sizing"
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- 挤准模
Related Translations:
size: n.1.大小，尺寸规模身材。2.(鞋帽等的)尺码，号；(纸张的)开。3.巨大，大量；相当大的分量。4.〔口语〕实情，真相。5.(人的)能力，才干，身价；(物的)质量，特性。6.量珠尺，珍珠筛。7.〔口语〕体重。8.〔古语〕(饭食、酒类的)定量；份饭。 短语和例子full size 如实物大。 life size 如真人一般大〔指雕像等〕。 a size seven hat sizer: n.1.分粒器，整粒器；大小分档拣理器。2.〔英俚〕极大的东西。3.【化学】上胶器，填料器。短语和例子an egg sizer 鸡蛋拣理器。 sized: adj.〔构成复合词〕1.有…大小的，…大小的，…号的，…开的。2.依据大小排列的。短语和例子small-sized 小型的，小号的。 medium-sized 中等大小的，中型的，中号的。 die: vi.(died; dying)1.死。2.灭亡，消灭；熄灭；枯死，凋落。3.漠然不受影响，感觉不到 (to) 。4.泄气。5.〔口语〕渴望，盼望〔参看 dying〕。6.【棒球】出局。7.〔美口〕好得要死，妙极了。短语和例子I thought I should have died. 要命要命〔大笑后口吻〕。 The secret died with him. 秘密跟他同时 dies: n.(sing., pl.) 〔拉丁语〕 日。 Dies Irae 1. 最后审判日。 2. 由Dies Irae 开头的拉丁文赞美诗。 dies non 1.停审日，休庭日。2.(须扣除不算的)假日。
- Example Sentences:
| 1. | No built - in charge pump leads to smaller die size and more cost savings
无内嵌的供给泵，这样就会带来更袖珍的小片尺寸以及更多的开销节省。 | | 2. | Citc schottky wafer capability : 14 to 275 mil die size , 0 . 1 to 120a current , 10 to 300v voltage
Fs8806espl ag - tag famegs ag - tag可提供一个简单容易的对嵌入式系统认证的解决方案。 | | 3. | The model is not only working perfectly , but also reducing the pin resource , die size and costs . 5
该模型不仅可以保证功能正确，而且节约了32根管脚资源，进而缩小了芯片面积、降低设计成本。 | | 4. | Designed and implemented nic with 0 . 35 um very large scale application specified integrated circuit ( asic ) the die size of nic reaches 350k gates and run at 200mhz 4
设计并实现了网络接口控制器nic 。 nic采用超大规模专用集成电路asic技术实现，芯片规模为35万门，采用0 . 35 m工艺，最高工作频率达到200mhz 。 | | 5. | The transistor count is 3 . 8 million ; the package is surface mount 240 - pin quad flat pack ( qfp240 ) ; and the die size is 98mm2 ; the most advanced research progress on microprocessor architecture is extensively studied to get technical preparations for microprocessor design
该处理器目前正在进行后端设计，即将采用0 . 25 mcmos工艺流片，整个处理器的晶体管数目为380万，封装形式是qfp240 ， die面积为98mm ~ 2 。 | | 6. | The implementation of in - chip clock generator is often based on modern cmos ic process technology which is usually adopted by very large scale digital system . while designing a deep sub - micrometer cmos circuit , delay , power consumption and die size are of the main factors that must be considered
使用现代深亚微米cmos集成电路工艺制造的内部时钟发生器要综合考虑延时、功耗、面积等各种重要因素，而且经常要针对soc系统的需求设计特殊的电路结构。 |
- Similar Words：
- "die sinking milling machine" English translation, "die sinking press" English translation, "die size" English translation, "die size out of the specification" English translation, "die size stock" English translation, "die sleeve" English translation, "die slide" English translation, "die slit" English translation, "die slot" English translation, "die slotting machine" English translation
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